Automatic Single Wafer Brushing Equipment
Xtrim-SC-BR300
Equipment Overview
LD/ULD、Brush Chamber、Clean Chamber、Transfer Module、Robot、CDU
Comprehensive Functions
Supports dual-sided brushing and edge brushing
Optional basic configurations: Nano-Spray、Mega-Sonic、DIW、N2
Customizable
Supports wafers from 6”to 12”
Customizable multi-chamber configuration based on the needs
Automation
Supports CMP system and offline tank loading
Automatic robot load/unload
Automatic make up and dosing
Pollution control
Professionally chosen material to better control particles
Modular wafer transfer between chambers in a sealed environment
Superior Process Performance
Particle: 26nm Average ≤ 10ea/Wafer @EE = 2
Metal: 1E8 atoms/cm2