Wet Bench Equipment

Enables immediate transfer to cleaning after lapping, preventing dried grinding slurry residue

Fully synchronized with lapping process cycle

Combines immersion ultrasonic cleaning, horizontal roller brush scrubbing, dual-fluid spray rinsing, and high-pressure air knife drying for rapid post-lapping wafer surface cleaning

Space-efficient design integrating advantages of batch immersion, single-wafer processing, and horizontal brush cleaning

Wet-in/dry-out operation with robotic arm automatic wafer handling; optional Open Cassette or FOUP unloading configurations